650V SiC Schottky diode for high-efficiency power conversion applications
| Model Number | SD650 |
| Max. Voltage | 650 V |
| Max. Current | 10 A |
| Package | TO-247-2L |
| Forward Voltage | 1.45 V |
| Reverse Recovery Time | 0 ns |
| Max. Junction Temperature | 200°C |
| Capacitance (Cj) | 250 pF |
The Wolfspeed SiC Schottky diode leverages the superior properties of silicon carbide (SiC) technology to provide zero reverse recovery losses, higher switching frequencies, and improved thermal performance compared to traditional silicon diodes. This device is ideal for high-efficiency power conversion applications where efficiency and reliability are paramount.
With its 650V rating and 10A current capacity, the SiC Schottky diode offers excellent performance in applications requiring high efficiency and reduced system size. The TO-247-2L package provides a robust mechanical and thermal interface for reliable operation.
Complete electrical, thermal, and packaging specifications for the SiC Schottky diode.
Detailed guide on implementing SiC Schottky diodes in power conversion applications.
Details about the TO-247-2L package mechanical dimensions and thermal properties.
SiC Schottky diodes offer several advantages over silicon diodes including zero reverse recovery losses, higher temperature operation, and improved switching performance. The wide bandgap properties of SiC enable these improvements, making SiC diodes ideal for high-efficiency power conversion applications where silicon diodes would suffer from significant switching losses.
SiC diodes improve power converter efficiency primarily through zero reverse recovery losses. Traditional silicon diodes have stored charge that must be removed during turn-on, causing significant switching losses. SiC Schottky diodes have no stored charge, eliminating these losses. Additionally, the higher switching frequencies enabled by SiC technology allow for smaller passive components and higher power density.
The TO-247-2L package is a 2-lead version of the popular TO-247 package. It provides a robust mechanical interface and good thermal characteristics for reliable operation. The 2-lead configuration simplifies board layout compared to 3-lead packages while maintaining excellent thermal performance.
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