Technical Support & Resources

Thermal management requirements depend on several factors: LED power consumption, ambient temperature, thermal resistance of the system, and desired operating life. A general rule is to maintain the LED junction temperature below the maximum rated value. Use Cree's thermal models and calculators to determine thermal resistance requirements for your specific application. Adequate heat sinking and proper thermal interface materials are critical for reliable operation.

SiC MOSFETs offer several significant advantages over silicon devices: 1) Lower switching losses due to reduced reverse recovery in the body diode, 2) Higher switching frequencies enabling smaller magnetic components, 3) Higher temperature operation capability (up to 200°C), 4) Higher breakdown field strength allowing thinner devices with lower RDS(on). These benefits result in higher efficiency, higher power density, and reduced system size.

LED selection involves several key parameters: 1) Required luminous flux (lumens), 2) Color properties (CCT and CRI), 3) Package size constraints, 4) Operating current/voltage specifications, 5) Luminous efficacy requirements, 6) Cost constraints. Additionally, consider environmental factors like operating temperature, humidity, and required lifetime. Cree's selection guides and online tools can help narrow down the options based on your key requirements.

Cree's XLamp series are high-power LEDs designed for applications requiring high lumen density and maximum optical performance. The J Series are mid-power LEDs optimized for applications where cost efficiency and ease of system design are important. J Series LEDs are available in 2835, 3030, and 5050 packages with lower thermal resistance and are easier to manufacture with. XLamp LEDs offer higher luminous efficacy and flux density.